12 November 2018

OFC San Diego

March 5-7, 2019, Booth #4627

nanosystec presents its NanoPlace Pick-and-Place station on OFC 2019, booth #4627 Also on display: NanoWeld active alignment and laser welding with minimum weld shift and NanoGlue Precision alignment and epoxy gluing. The stations provide excellent results combined with ultra-short processing times.

The NanoWeld and NanoGlue stations align in the sub-micrometer-regime. The position of the parts to be joined needs to be maintained during assembly. Smart geometrical arrangement of the devices as well as high-precision subassemblies provide unparalleled repeatability.

Ultrafast Optical Alignment with OptoSpinOptoSpin brings an additional level of throughput to optoelectronic device packaging. This new development of nanosystec reduces active alignment times to a fraction of usual processes while maintaining the high accuracy in the sub micrometer regime. Combined with multichannel measurement and automated loading, process times can be cut substantially.

nanosystec offers OptoSpin also in their NanoTest stations for the fast electrical and optical testing of Silicon Photonics.

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